SLS Femto
The SLS Femto is a new glass & sapphire laser cutting and dicing workstation ideal for research & development, and volume manufacturing.
It is based on patented glass & sapphire cutting technology, which is unique for
ultra-high quality and precision results. Understanding market needs and the growing demand for glass as a material, we have developed a unique state-of-the-art glass and sapphire cutting & dicing technology to overcome today’s market challenges.
Our technology outperforms other glass-cutting methods and thus is very well applicable in semiconductors, microfluidics, and micro-optics industries.
Features:
Ultra-thin (30 µm to 2 mm in a single pass) glass & sapphire cutting
High process speed – up to 800 mm/s
All shapes: circular, square, irregular
Tunable dicing process for different substrate thicknesses
Inner and outer contours
Easy breaking for non-tempered glass and self-breaking for tempered glass
